Product Description

5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.

Product Detail

5CEFA9F23I7N has many outstanding performance characteristics. First of all, it has 301,000 logic elements, providing strong support for complex logical operations and digital signal processing. The number of its adaptive logic modules (ALM) reaches 113,560, which can flexibly adapt to the needs of various application scenarios. This chip also has an embedded memory of up to 13.59 megabits (Mb), providing sufficient space for data storage and processing. In terms of performance, the maximum operating frequency of 5CEFA9F23I7N can reach 800MHz, which can quickly process a large amount of data. Its working voltage range is between 1.07V and 1.13V. The relatively low voltage helps reduce power consumption. In addition, this chip is humidity sensitive, which means that during use, attention needs to be paid to the influence of environmental humidity to ensure the stable operation of the chip. 5CEFA9F23I7N also supports multiple packaging types, such as FBGA-484. This packaging method has good heat dissipation performance and reliability.

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