FPC soft board is an important electronic component. It is also the carrier of electronic components and the electrical connection of electronic components. Through the analysis of the development of FPC soft board in the main regions, the market development trend and the comparative analysis of domestic and foreign markets, this paper gives you a better understanding of FPC Industry.
Development analysis of main areas of FPC soft board
The Yangtze River Delta and the Pearl River Delta are the more developed areas of domestic electronic technology products, and also the birthplace of it and FPC soft board. They have special advantages in geography, talents and economic environment. At present, they are in the upgrading stage of industrialization. FPC soft board low-end products are gradually transferred to other parts of the mainland, while high-end products and high value-added products continue to focus on the Yangtze River Delta and Pearl River Delta. The future of domestic FPC soft board industry is likely to be formed in the Pearl River Delta. The Yangtze River Delta is used as a high-end FPC soft board manufacturing, equipment and material R & D base; Along the Yangtze River, including Chongqing, Sichuan, Hubei, Anhui and other world top 500 electronic enterprises as the leaders of the second hour economic industrial zone; Even to the north as the leader of the Bohai Bay Economic Circle; And opened the industrial pattern of the northwest processing zone of the Hong Kong Zhuhai Macao Bridge.
Market development trend
In terms of the number of layers and the development of FPC flexible board, the FPC flexible board industry is divided into six parts: single panel, double-sided board, conventional multilayer board, flexible board, HDI (high density interconnect) board and packaging substrate. From the four cycle dimensions of the product life cycle "import growth stage to the recession maturity stage", the single panel and double sided boards are not as good as the trend of current electronic products application, but the trend is light, short, small, and declining. The proportion of output value is decreasing gradually. The developed countries and regions such as Japan, Korea and China Taiwan seldom produce these products in China. Many manufacturers have clearly indicated that they are no longer connected to single products and double sided boards. The traditional multilayer board and HDI are mature products, and the process capability is becoming more and more mature. At present, most of the products with high added value are mainly the main direction of FPC soft board factory, and only ultrasonic electronics and a few Chinese manufacturers master the production technology; Flexible board is especially suitable for high-density flexible board and rigid connecting board. Because the current technology is not mature, it fails to realize mass production by a large number of manufacturers, which belongs to the product growth period. However, because its height is more suitable for the characteristics of digital products than rigid board, the high growth of flexible board is the future development direction of all manufacturers. At present, most of the products with higher added value are the main direction of FPC soft board factories. Only ultrasonic electronics and a few Chinese manufacturers master the production technology; Flexible board is especially suitable for high-density flexible board and rigid connecting board. Because the current technology is not mature, it fails to realize mass production by a large number of manufacturers, which belongs to the product growth period. However, because its height is more suitable for the characteristics of digital products than rigid board, the high growth of flexible board is the future development direction of all manufacturers. At present, most of the products with higher added value are the main direction of FPC soft board factories. Only ultrasonic electronics and a few Chinese manufacturers master the production technology; Flexible board is especially suitable for high-density flexible board and rigid connecting board. Because the current technology is not mature, it fails to realize mass production by a large number of manufacturers, which belongs to the product growth period. However, because its height is more suitable for the characteristics of digital products than rigid board, the high growth of flexible board is the future development direction of all manufacturers.
IC package substrate, R & amp; R＆amp; D, Japan, South Korea and other developed countries have relatively mature electronic industry manufacturing, but it is still in the exploratory stage in China. Only ibiden (Beijing) Co., Ltd., ASE semiconductor (Shanghai) Co., Ltd. and Zhuhai Doumen Chaoyi Electronics Co., Ltd. are a few small batch manufacturers. This is because China's IC industry is still underdeveloped, but with the multinational electronics giants will continue to ICR & amp; D organization moved to China, China's own ICR & amp; With the improvement of D and production level, the packaging substrate will have a huge market, which is the development direction of the vision of large manufacturers.
China's hardboard (single panel, double-sided, multi-layer PCB, HDI board) accounts for 70%. This proportion is the largest proportion of multilayer board accounting for 5%, followed by soft board accounting for 15.6%. Due to the pressure of oversupply, most manufacturers entered a price war, and the output growth was lower than expected.
From the perspective of the future development trend of domestic FPC products, the output is slightly lower than the growth of sales volume, mainly due to the gradual development of product structure to multi-layer and high precision. China's HDI multilayer board and industry are growing, expanding, and the technology is becoming more and more mature. Multilayer board is the mainstream of market developme