1. Flexible aluminum substrate
One of the new developments of IMS materials is flexible dielectrics, which have excellent electrical insulation, flexibility and thermal conductivity. When applied to flexible aluminum, the product can be shaped into various shapes and angles, eliminating expensive clamps, cables and connectors. It is common for two or four layer sub assemblies made of traditional FR-4 to be bonded to the aluminum substrate with thermoelectric medium to help heat dissipation, increase stiffness and act as a shielding layer. In the high-performance power market, these structures have one or more layers of circuits buried in the dielectric, and blind holes are used as thermal through holes or signal paths.
2. Through hole aluminum base plate
In complex structures, a layer of aluminum can form the "core" of multi-layer thermal structure. Before lamination, aluminum is pre plated and filled with dielectric. Electroplate through holes through gaps in aluminum to maintain electrical isolation. Due to its good thermal conductivity, it is considered to be the general name of PCB specially used in LED industry.
In a word, PCB aluminum substrate types of PCB manufacturers include flexible aluminum substrate and through-hole aluminum substrate. For purposes, there are also double-sided designs of circuit layer, insulation layer, aluminum base, insulation layer and circuit layer structure. Very few applications are multilayer boards, which can be made by laminating ordinary multilayer boards with insulating layers and aluminum substrates. Aluminum substrate has excellent heat dissipation, good machinability, dimensional stability and electrical performance. It is widely used in the fields of hybrid integrated circuits, automobiles, office automation, large power electrical equipment, power equipment, etc