XCKU060-2FFVA1517E

XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.

Functional Features

Improve system performance

6.3 TeraMAC's DSP Computing Performance

The system level performance per watt is more than twice that of Kintex-7 FPGA

Supports 16G and 28G backplane transceivers

Medium speed 2666 Mb/s DDR4

Total power consumption reduction

Compared to the previous generation product, power consumption can be reduced by up to 40%

Implementing fine-grained clock gating similar to ASIC clock functionality through UltraScale devices

Enhanced system logic unit encapsulation reduces dynamic power consumption

Accelerate design efficiency

Script and Virtex ®  UltraScale device compatibility for scalability

With Vivado ®  The design suite is optimized together to quickly complete the design