XCKU3P-2SFVB784I

XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology.

The "2SFVB784I" in the name of XCKU3P-2SFVB784I refers to the batch and brand codes as well as the speed, temperature and grade characteristics of the chip. This chip is of industrial-grade and can sustain harsh conditions.

This chip is designed for applications that require a high level of performance and flexibility, such as data center acceleration, wireless communication, and high-performance computing. It is equipped with high-speed interfaces such as 10/25/40/100 Gigabit Ethernet, PCI Express Gen3 x16, and DDR4 SDRAM memory interfaces, and can run at a maximum frequency of 1.2GHz with a power consumption of 50W.

The XCKU3P-2SFVB784I also features advanced I/O capabilities, including tri-mode Ethernet, serial transceiver, and high-speed serial connectivity. The chip supports advanced algorithms and designs and is programmable using Xilinx's Vivado® Design Suite tool.

Overall, XCKU3P-2SFVB784I is a high-performance and flexible FPGA chip suitable for high-end applications, including artificial intelligence, high-speed networking, video processing, and high-performance computing. The chip's powerful resources and flexibility make it a popular choice among developers working on high-performance engineering applications in industrial, automotive, and aerospace sectors.