XCVU7P-2FLVA2104I

The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

Application:

Calculation acceleration

5G baseband

Wired communication

radar

Testing and measurement

Product attributes

Device: XCVU7P-2FLVA2104I

Product type: FPGA - Field Programmable Gate Array

Series: XCVU7P

Number of logic components: 1724100 LE

Adaptive Logic Module - ALM: 98520 ALM

Embedded memory: 50.6 Mbit

Number of input/output terminals: 884 I/O

Power supply voltage - minimum: 850 mV

Power supply voltage - maximum: 850 mV

Minimum working temperature: -40 ° C

Maximum working temperature:+100 ° C

Data rate: 32.75 Gb/s

Number of transceivers: 80

Installation style: SMD/SMT

Package/Box: FBGA-2104

Distributed RAM: 24.1 Mbit

Embedded Block RAM - EBR: 50.6 Mbit

Humidity sensitivity: Yes

Number of logical array blocks - LAB: 98520 LAB

Working power supply voltage: 850 mV