XCVU13P-3FIGD2104E

XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications:

Number of logic elements: There are 3780000 logic elements (LE).

Adaptive Logic Module (ALM): Provides 216000 ALMs.

Embedded memory: Built in 94.5 Mbit of embedded memory.

Number of input/output terminals: Equipped with 752 I/O terminals.

Working voltage and temperature range: The working power supply voltage is 850 mV, and the working temperature range is 0 ° C to+100 ° C.

Data rate: Supports a data rate of 32.75 Gb/s.

Number of transceivers: There are 128 transceivers.

Packaging type: FBGA-2104 packaging is used.

In addition, the XCVU13P-3FIGD2104E FPGA chip also supports HBM and CCIX technologies, which improve memory bandwidth and reduce power consumption per unit bit, making it particularly suitable for computationally intensive applications that require high memory bandwidth, such as machine learning, Ethernet interconnection, 8K video, and radar applications. These features make XCVU13P-3FIGD2104E an ideal choice for handling high-performance computing needs in these applications